Heatsink Thermal Pads - Pack of 5
HSFPHASECMImproves heat transfer between a CPU/chipset and heatsink with easy-to-use thermal pads
This 5 pack of Thermal Pads offers a suitable alternative to using heatsink paste/grease. The thermal pads remain solid at room temperature, and soften at heatsink operating temperatures - eliminating the mess of heat grease, while maximizing heat conduction to create a cooler operating environment for your hard working CPU.
The StarTech.com Advantage
- Easy "peel and stick" installation ensures an even application each time
- Mess free
Features
- Low thermal impedance
- Electrically non-conductive
- Solid at room temperature, it softens at heatsink operating temperatures
- Conforms to surface irregularities
Applications
- Replaces traditional heatsink grease
Product Numbers
| Ingram Micro Netherlands | 1861185 |
| UPC Code | 065030809191 |
Technical Specifications
| Warranty Information | |
|---|---|
| Warranty | 2 Years |
| Performance | |
| Thermal Conductivity | 0.7 W/m-k |
| Thermal Resistance | 0.03 °C-in/W @ 50 PSI |
| Specific Gravity | 1.11 |
| Physical Characteristics | |
| Color | Pink |
| Materials | Phase Change Temperature: 58°C
Volume Resistivity: 1x 1015 Ohm-cm |
| Product Length | 30 mm [1.2 in] |
| Product Width | 30 mm [1.2 in] |
| Product Height | 0.1 mm [0 in] |
| Environmental | |
| Operating Temperature | -60°C to 125°C (-76°F to 257°F) |
| Special Notes / Requirements | |
| Note | Heatsink/Component Clamping Pressure (Recommended): 5 to 100 PSI (0.035 to 0.690 MPa) |
| Packaging Information | |
| Package Quantity | 5 |
| Shipping (Package) Weight | 0 kg [0 lb] |
| What's in the Box | |
| Included in Package | 5 - Thermal Pad |
Certifications, Reports and Compatibility
Related Products
Downloads
Manual(s):
- HSFPHASECM.pdf
English
Data Sheet(s)
- HSFPHASECM_Datasheet.pdf
English - HSFPHASECM_Datasheet-ES.pdf
Español - HSFPHASECM_Datasheet-FR.pdf
Français - HSFPHASECM_Datasheet-IT.pdf
Italiano - HSFPHASECM_Datasheet-NL.pdf
Nederlands




